热销产品
IGBT�？樯⑷壬杓撇慰嘉募�
1.华为-热设计培训教材.pdf
提纲
一、热设计基础知识
1、热量传递的三种基本方式
2、热阻的概念
二、器件热特性
1、认识器件热阻
2、典型器件封装散热特性
3、单板器件的散热路径
三、散热器介绍
四、导热介质介绍
五、单板强化散热措施
1、PWB热特性
2、PWB强化散热措施
六、单板布局原则
2. igbt的散热设计.pdf
一、热设计基础知识
1、热量传递的三种基本方式
2、热阻的概念
二、器件热特性
1、认识器件热阻
2、典型器件封装散热特性
3、单板器件的散热路径
三、散热器介绍
四、导热介质介绍
五、单板强化散热措施
1、PWB热特性
2、PWB强化散热措施
六、单板布局原则
功率�？榧白爸玫娜壬杓�
The purpose of thermal design
The utilizations of the thermal simulation
Main purposes of thermal analysis
1.Prediction of component temperatures;
2. Design optimization for good reliability.
Methods for Heat Dissipation
How to Choose a Proper Method?
Reference for Choosing Cooling Method
Applications of Cooling Techniques
Comparison of Various Cooling Techniques
Comparison of Two-Phase Cooling
Thermal simulation
Thermal simulation (render)
Thermal simulation (render)
Thermal test
影响热分析精度的因素
The purpose of thermal design
The utilizations of the thermal simulation
Main purposes of thermal analysis
1.Prediction of component temperatures;
2. Design optimization for good reliability.
Methods for Heat Dissipation
How to Choose a Proper Method?
Reference for Choosing Cooling Method
Applications of Cooling Techniques
Comparison of Various Cooling Techniques
Comparison of Two-Phase Cooling
Thermal simulation
Thermal simulation (render)
Thermal simulation (render)
Thermal test
影响热分析精度的因素
3. 艾默生电子设备的自然冷却热设计规范.pdf
共两部分：
共两部分：
1. 电子设备的自然冷却热设计规范
2. 电子设备的强迫风冷热设计规范
目录 ................................................................................................................................... 3
前言 ................................................................................................................................... 5
1目的 ................................................................................................................................ 6
2 适用范围 ....................................................................................................................... 6
3 关键术语 ....................................................................................................................... 6
4引用/参考标准或资料 ................................................................................................... 7
5 规范内容 ....................................................................................................................... 7
5.1 遵循的原则 ................................................................................................................ 7
5.2 产品热设计要求 ........................................................................................................ 8
5.2.1产品的热设计指标 .................................................................................................. 8
5.2.2 元器件的热设计指标 ............................................................................................. 8
5.3 系统的热设计 ............................................................................................................ 9
5.3.1 常见系统的风道结构 ............................................................................................. 9
5.3.2 系统通风面积的计算 ........................................................................................... 10
5.3.3 户外设备(机柜)的热设计 ................................................................................... 11
5.3.3.1 太阳辐射对户外设备(系统)的影响 ................................................................ 11
5.3.3.2 户外柜的传热计算 ............................................................................................ 13
5.3.4 系统前门及防尘网对系统散热的影响 ............................................................... 15
5.4 �？榧兜娜壬杓� ...................................................................................................... 15
5.4.1 �？樗鸷牡募扑惴椒� ......................................................................................... 15
5.4.2 机箱的热设计 ....................................................................................................... 15
5.4.2.1 机箱的选材 ........................................................................................................ 15
5.4.2.2 �？榈纳⑷攘康募扑� ........................................................................................ 15
5.4.2.3 机箱辐射换热的考虑 ........................................................................................ 16
5.4.2.4 机箱的表面处理 ................................................................................................ 17
5.5 单板级的热设计 ...................................................................................................... 17
5.5.1 选择功率器件时的热设计原则 ........................................................................... 17
5.5.2 元器件布局的热设计原则 ................................................................................... 17
5.5.3 元器件的安装 ....................................................................................................... 18
5.5.4 导热介质的选取原则 ........................................................................................... 19
5.5.5 PCB板的热设计原则 ........................................................................................... 20
5.5.6 安装PCB板的热设计原则 ................................................................................. 22
5.5.7 元器件结温的计算 ............................................................................................... 22
5.6 散热器的选择与设计 .............................................................................................. 23
5.6.1散热器需采用的自然冷却方式的判别 ................................................................ 23
5.6.2 自然冷却散热器的设计要点 ............................................................................... 23
5.6.3 自然冷却散热器的辐射换热考虑 ....................................................................... 24
5.6.4 海拔高度对散热器的设计要求 ........................................................................... 24
5.6.5 散热器散热量计算的经验公式 ........................................................................... 25
5.6.6强化自然冷却散热效果的措施 ............................................................................ 25
6 产品的热测试 ............................................................................................................ 25
6.1 进行产品热测试的目的 .......................................................................................... 25
6.1.1热设计方案优化 .................................................................................................... 26
6.1.2热设计验证 ............................................................................................................ 26
6.2热测试的种类及所用的仪器、设备 ....................................................................... 26
6.2.1温度测试 ................................................................................................................ 26
7 附录 ............................................................................................................................. 27
7.1 元器件的功耗计算方法 .......................................................................................... 27
7.2 散热器的设计计算方法 .......................................................................................... 29
7.3自然冷却产品热设计检查模板 ............................................................................... 30
2. 电子设备的强迫风冷热设计规范
目录 ................................................................................................................................... 3
前言 ................................................................................................................................... 5
1目的 ................................................................................................................................ 6
2 适用范围 ....................................................................................................................... 6
3 关键术语 ....................................................................................................................... 6
4引用/参考标准或资料 ................................................................................................... 7
5 规范内容 ....................................................................................................................... 7
5.1 遵循的原则 ................................................................................................................ 7
5.2 产品热设计要求 ........................................................................................................ 8
5.2.1产品的热设计指标 .................................................................................................. 8
5.2.2 元器件的热设计指标 ............................................................................................. 8
5.3 系统的热设计 ............................................................................................................ 9
5.3.1 常见系统的风道结构 ............................................................................................. 9
5.3.2 系统通风面积的计算 ........................................................................................... 10
5.3.3 户外设备(机柜)的热设计 ................................................................................... 11
5.3.3.1 太阳辐射对户外设备(系统)的影响 ................................................................ 11
5.3.3.2 户外柜的传热计算 ............................................................................................ 13
5.3.4 系统前门及防尘网对系统散热的影响 ............................................................... 15
5.4 �？榧兜娜壬杓� ...................................................................................................... 15
5.4.1 �？樗鸷牡募扑惴椒� ......................................................................................... 15
5.4.2 机箱的热设计 ....................................................................................................... 15
5.4.2.1 机箱的选材 ........................................................................................................ 15
5.4.2.2 �？榈纳⑷攘康募扑� ........................................................................................ 15
5.4.2.3 机箱辐射换热的考虑 ........................................................................................ 16
5.4.2.4 机箱的表面处理 ................................................................................................ 17
5.5 单板级的热设计 ...................................................................................................... 17
5.5.1 选择功率器件时的热设计原则 ........................................................................... 17
5.5.2 元器件布局的热设计原则 ................................................................................... 17
5.5.3 元器件的安装 ....................................................................................................... 18
5.5.4 导热介质的选取原则 ........................................................................................... 19
5.5.5 PCB板的热设计原则 ........................................................................................... 20
5.5.6 安装PCB板的热设计原则 ................................................................................. 22
5.5.7 元器件结温的计算 ............................................................................................... 22
5.6 散热器的选择与设计 .............................................................................................. 23
5.6.1散热器需采用的自然冷却方式的判别 ................................................................ 23
5.6.2 自然冷却散热器的设计要点 ............................................................................... 23
5.6.3 自然冷却散热器的辐射换热考虑 ....................................................................... 24
5.6.4 海拔高度对散热器的设计要求 ........................................................................... 24
5.6.5 散热器散热量计算的经验公式 ........................................................................... 25
5.6.6强化自然冷却散热效果的措施 ............................................................................ 25
6 产品的热测试 ............................................................................................................ 25
6.1 进行产品热测试的目的 .......................................................................................... 25
6.1.1热设计方案优化 .................................................................................................... 26
6.1.2热设计验证 ............................................................................................................ 26
6.2热测试的种类及所用的仪器、设备 ....................................................................... 26
6.2.1温度测试 ................................................................................................................ 26
7 附录 ............................................................................................................................. 27
7.1 元器件的功耗计算方法 .......................................................................................... 27
7.2 散热器的设计计算方法 .......................................................................................... 29
7.3自然冷却产品热设计检查模板 ............................................................................... 30
1．目的及适用范围
2． 引用标准
3． 相关术语的定义
4． 电子设备热设计的指标要求
5． 电子设备热设计的流程
6． 热设计的基本理论及基本原则
7．热设计方法之一—热分析计算
8 热设计方法之二—热仿真
2． 引用标准
3． 相关术语的定义
4． 电子设备热设计的指标要求
5． 电子设备热设计的流程
6． 热设计的基本理论及基本原则
7．热设计方法之一—热分析计算
8 热设计方法之二—热仿真
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